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SciTech-ICEE-Industrial Standard - Packaging(Chips)

Analog: Ball Grid Array (BGA) Packages and PCB Design Guidelines

Figure 1. Analog BGA package cross-section drawing (not to scale)	Figure 2. Illustration of NSMD land pad pattern.	Figure 3. Recommended reflow profile for Pb-free solders, per JEDEC JSTD-020.

Ball Grid Array (BGA) Packages and PCB Design Guidelines
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Abstract

This application note discusses Analog Devices’ BGA packages, and provides PCB design and board assembly process guidelines.

Introduction

Analog's BGA packages consist of one or more dice connected to a laminate substrate in either wire-bonded or flip-chip configurations. Some packages may contain surface-mounted components (SMTs), depending on the application. A representative image of the package cross-section is shown in Figure 1.

Analog BGA package cross-section drawing (not to scale)

Figure 1. Analog BGA package cross-section drawing (not to scale)

PCB Design

Analog BGA packages use solder mask-defined (SMD) pins/ balls.

Two types of land patterns are used for surface-mount devices:

• Solder Mask-Defined (SMD) pads have solder mask openings that are smaller than metal pads.
• Non-Solder Mask-Defined (NSMD) pads have solder mask opening that are larger than the metal pads.

Analog recommends the use of NSMD pads due to the following advantages: (i) Copper etching process has better control compared to solder masking, and (ii) NSMD provides a large metal area for the solder to anchor to (pad area + vertical edges of pad).

IPC-7351 guidelines can be used to design PCB pad patterns based on the package outline drawings for the respective packages. The IPC land pattern calculator can be downloaded from the IPC website (www.ipc.org).

For NSMD

PCB land pad dimensions are recommended to be equal to the BGA ball size. Solder mask opening should be BGA ball size + 0.1mm.

Illustration of NSMD land pad pattern.

Figure 2. Illustration of NSMD land pad pattern.

PCB Surface Finish

The selection of an appropriate PCB pad surface finish is critical to ensuring optimum manufacturing of the final board assembly. Popular surface finishes for PCB pads are listed below:

• OSP (Organic Solderability Preservative)—Recommended
• ENIG (Electroless Nickel, Immersion Gold)—Recommended
• Electroplated Nickel, Gold
• Immersion Ag
• Immersion Sn

Stencil Design

The stencil thickness and pattern geometry determine the precise volume of solder paste deposited onto the device land pattern. Stencil alignment accuracy and consistent solder volume transfer are critical for uniform solder reflow. Stainless steel stencils are preferred. Stencils should be laser-cut and then electro-polished for better release than the regular laser-cut stencil.

The recommended stencil thickness is 4mils (0.100mm).

The stencil apertures are recommended to be circular in shape, and the same size as the PCB land pad. The tolerances must be tightly controlled as they can effectively reduce aperture size. Walls of the apertures should be: (i) smooth, and (ii) with a trapezoidal cross-section (bottom opening larger than top) to enhance the release of solder paste from the aperture. Stencil aperture must meet the industry-standard area ratio of (Area of aperture opening/aperture wall area) > 0.66.

Solder Paste

A low-residue, no-clean solder paste is recommended for mounting BGA packages. Type III or IV solder pastes are best suited for the typical pitch used in Analog's modules. Nitrogen purge is recommended during solder reflow. Follow the paste supplier's recommended stencil clean frequency for respective solder pastes.

Recommended solder paste compositions are shown below:

Lead-free (recommended): SAC (Sn-Ag-Cu) alloys (SAC305)
Lead-based: Sn/Pb alloys (Sn63Pb37)

Screen Printing

A metal squeeze should be used with a 45° to 60° print angle. For printing, 20mm/sec should be used as a starting speed, with speed being increased as necessary. Pressure of ～10N/mm should be applied with the squeeze while printing. The snap of distance should be 0mm. Also, it is recommended to do a post-printing solder inspection to check for print quality.

Placement

A standard pick and place machine with 0.05mm accuracy can be used for placing the BGA modules on the printed solder. Low mounting speed is recommended to prevent the paste from squeezing out.

Reflow

It is recommended to use a forced convection oven with nitrogen, having temperature uniformity within ±5°C. Reflow profile guidelines from the solder paste's data sheet should be followed. The guidelines are based on the temperature at the actual joint location; the actual temperature of the solder joint often differs from the temperature settings in the reflow system depending on board density, board thickness, and other parts mounted on the board. It is recommended that the profiles be checked using thermocouples at the solder joint locations prior to being used for the actual board interconnection reflow. Figure 3 shows the recommended reflow profile for Pb-free solders, per JEDEC JSTD-020.

Double-sided reflow should not be performed for these BGA modules.

Cleaning

If low-residue, no-clean solder paste is used, cleaning is generally not required. It is recommended that the supplier's guidelines for cleaning be adhered to. If cleaning is done, boards need to be dried later.

Solder Joint Voiding

IPC recommends the use of a maximum void spec of 25% for solder joints. If higher voiding percentage is observed, increasing the soak time can be evaluated as an option.

Rework

Component Removal

An appropriate rework station should be used for any rework on the parts. It is strongly recommended to bake the PCB assembly at 125°C for 24 hours to eliminate residual moisture before component removal. The bottom of the PCB should be heated using convective heaters, while hot air or gas is used on the top side of the component (this is to prevent warpage). A special nozzle should be used to direct the air to the component only in order to reduce heating of adjacent components. Thermocouples should be used on the top and bottom sides to monitor actual temperature at the part. Maximum part temperature should be above the liquidus temperature of 217°C, but should not exceed 260°C. Once the joints have reflowed, the vacuum lift-off should be automatically engaged during the transition from reflow to cool down. The vacuum pressure should be kept below 15 in. of Hg to ensure the component is not lifted out if all joints have not been reflowed.

Site Redress

Following component removal, the PCB site should be properly cleaned, while taking care that the pads are not damaged. The PCB pads should then be cleaned with a solvent; the solvent is usually specific to the type of paste used in the original assembly. The paste manufacturer’s recommendations should be followed.

Solder Paste Printing

It is recommended that a miniature stencil be used to print solder paste on the PCB surface at the component site. Follow stencil thickness, stencil design, solder recommendations, and screen-printing guidelines, as provided for original PCB assembly. Inspect the site before replacing the new part.

Component placement

A new replacement part should be used; it is not recommended to use the removed part. A split-beam optical system should be used to align the component on the PCB (as the leads are at the bottom of the package) as this this will provide an image of leads overlaid on the mating footprint and aid in proper alignment. A placement machine having 0.05mm placement accuracy should be used.

Reflow

The same reflow profile as provided for initial-component-attach reflow is recommended to be used. X-ray can be used to ensure that all the joints are formed successfully.

Units Shipping

Parts will be shipped in tray or tape-and-reel form. All parts will be baked and dry-packed with desiccants and a humidity indicator card. If the humidity indicator card has turned pink, or if the parts have been exposed to longer than their floor life, packages should be baked at 125°C for 48 hours. Refer to JEDEC specification J-STD-033C for correct use of moisture/reflow-sensitive surface-mount devices.

Maximum allowable downward pressure that can be applied on Analog’s BGA packages.

Below mentioned guidelines should be followed for the maximum downward pressure that can be applied to the top of Analog's BGA packages. These guidelines assume that the printed-circuit board (PCB) is supported properly to prevent flexing or bowing.

Maximum downward force to be applied during a one-time instance (e.g., heat sink attach) should not exceed ~20 grams/BGA ball
Maximum continuous/sustained force applied should not exceed ～4 grams/BGA ball
These are strictly guidelines and may require further optimization.

Packaging of Electrical Chips

BGA(Ball Grid Array球栅网格阵列)

Ball Grid Array (BGA) packages are widely used in modern electronics because they allow:
high pin counts, better heat dissipation, and compact board design compared to traditional chip packages.

From smartphones and laptops to advanced circuit boards,
BGA technology plays a critical role in performance and miniaturization.
Understanding how BGA works, its benefits, and its repair challenges,
helps engineers, students, researchers, scientists and electronics enthusiasts make wise troubleshooting and design decisions.

Quick Summary:
Ball Grid Array (BGA) package explained covers its
structure, solder ball connections, space-saving design, thermal performance,
and common uses in modern electronics,
helping readers understand requirements, questions/issues, products, designs, engineering, advantages, repair challenges,
and why BGA is widely used in compact devices.

Author

Written & Verified by Santosh Das
This article is written and reviewed by Santosh Das, an electronics and technology blogger with over 25 years of real-world experience.

Table of Contents:

What is a Ball Grid Array (BGA) Package?
How Does a BGA Package Work?
BGA Package Types
Common BGA Package Sizes
Ball Grid Array Soldering Process
What is the BGA Package Process?
BGA vs LGA vs PGA: Key Differences
Ball Grid Array (BGA) Market Stats & Trends
Final Conclusion
BGA Frequently Asked Questions
What is a BGA package?
How does BGA differ from PGA?
Why use BGA in PCBs?
What are BGA sizes?
Can BGA be reused?

What is a Ball Grid Array (BGA) Package?

Ball Grid Array (BGA) Package

A Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits (ICs). Unlike traditional SMD Components with pins around the edge, BGA packages have tiny solder balls arranged in a grid on the underside of the package. These balls serve as the connection points to the PCB (Printed Circuit Board).

How Does a BGA Package Work?

A BGA package connects to a PCB using solder balls that are melted during the reflow soldering process. Once cooled, the balls solidify and form a permanent electrical and mechanical connection. This allows for higher I/O density, better thermal performance, and reliable high-frequency signal transmission.

BGA Package Types

There are several types of BGA packages,
each designed for specific applications:
Chips & Processors

BGA Type	Description
PBGA (Plastic BGA)	Common and cost-effective; used in consumer electronics.
CBGA (Ceramic BGA)	Better thermal conductivity; ideal for military/aerospace.
TBGA (Tape BGA)	Thin and flexible; used in mobile devices.
MBGA (Micro BGA)	Smaller form for compact electronics.

Common BGA Package Sizes

BGA sizes are defined by the ball pitch (distance between balls) and the overall package dimensions.

BGA Size (mm)	Ball Pitch(mm) Usage
10×10 0.5 mm	Smartphones, IoT Devices
15×15 0.8 mm	Microcontrollers
25×25 1.0 mm	FPGAs, GPUs

Ball Grid Array Soldering Process

What is the BGA Package Process?

The BGA soldering process involves:Metals & Mining

• Solder Paste Application – Applying solder paste on PCB pads.
• Component Placement – Positioning the BGA chip using pick-and-place machine.
• Reflow Soldering – Heating to melt the solder balls and form connections.
• Inspection – X-ray Inspection to inspect hidden solder joints.

➡ For in-Depth Detailed Explanation – Please Check:
SMT PCB Assembly Process: Steps & Flow Chart

BGA vs LGA vs PGA: Key Differences

Feature	BGA (Ball Grid)	LGA (Land Grid)	PGA (Pin Grid)
Connection Type	Solder Balls	Flat Pads	Metal Pins
Soldering	Reflow	Socket/Contact Pads	Insertion into Socket
Size	Very Compact	Compact	Bulky
Durability	High	Medium	Low (Pin Damage)

Ball Grid Array (BGA) Market Stats & Trends

• BGA usage in consumer electronics is expected to grow by 6.8% CAGR by 2028.
  (Source: MarketsandMarkets)
• Over 85% of modern CPUs and GPUs use some form of BGA packaging.
  (Source: Intel Packaging Guide)

Final Conclusion

The Ball Grid Array (BGA) package plays a vital role in enabling powerful, compact, and reliable electronics. With its ability to handle high I/O density and better thermal management, BGA is the preferred choice in high-performance computing and miniaturized devices. Whether you are an engineer, a PCB designer, or an OEM buyer, understanding the BGA package process, sizes, types, and soldering method can help you build more efficient and durable electronics systems.

Manufacturing

SMT PCB Assembly Process: Step-by-Step Guide with Flow Chart

by Santosh Das | Last Updated On August 30, 2025Electronic Components

SMT PCB assembly process with step-by-step instructions and flow chart.

8 Steps in SMT PCB Assembly Process

Step #	SMT Step	Description
1	SPP(Solder Paste Printing)	Apply solder paste to PCB pads using a stencil.
2	SPI(Solder Paste Inspection)	Verifies correct application of solder paste.
3	Pick and Place	Automated placement of SMD components.
4	Reflow Soldering	Heats the PCB to melt solder paste and form solid joints.
5	AOI(Automated Optical Inspection)	Checks for soldering and placement defects visually.
6	Manual Inspection	Human inspection for issues missed by machines.
7	Functional Testing	Verifies electrical functionality of the PCB.
8	FQC(Final Quality Control)	Confirms overall assembly quality before shipment.

Detailed SMT PCB Assembly Process – Step-By-Step Guide

Let us break down and understand each step of the SMT PCB Assembly Process in detail:

1. Solder Paste Printing
   A stainless-steel stencil and squeegee apply solder paste to precise locations on the PCB pads.
2. Solder Paste Inspection (SPI)
   This automated system checks for correct volume, alignment, and coverage of the solder paste.
3. Pick and Place
   High-speed SMT machines place SMD components on the board based on CAD design files.
4. Reflow Soldering
   The PCB goes through a reflow oven, where controlled heat melts the solder paste and forms strong joints.
5. Automated Optical Inspection (AOI)
   Automated Optical Inspection (AOI) uses cameras to detect issues like tombstoning, misalignment, or missing components.Metals & Mining
6. Manual Inspection
   Human operators verify any defects flagged by AOI and SPI, especially in complex or small-batch runs.
7. Functional Testing
   Electrical tests ensure the PCB functions as designed before shipping.
8. Final QC & Packaging
   A final quality inspection guarantees every board meets industry standards and customer requirements.

Video: Surface Mount Technology (SMT) Process

Key SMT Assembly Statistics for Process Optimization

Statistic	Value
SMT Component Placement Accuracy	±0.01 mm
Global SMT Equipment Market Size	$6.2 Billion USD
Average SMT Line Throughput	25,000–80,000 CPH (components per hour)
First Pass Yield Target	>98%

➡ Source: ASMPT | SMTA.org

Understanding the Metals and Mining Sector

Gemini generated content may include mistakes

The metals and mining sector is a foundational industry, extracting raw materials from the earth that are essential for countless other sectors.

• Key Players: BHP Group
  BHP Group is a global leader, operating across a diverse range of commodities including iron ore, copper, coal, and nickel. Their extensive operations span multiple continents, making them a significant barometer for the health of the broader mining industry and global economic demand.

• Key Players: Rio Tinto
  Rio Tinto is another major participant, primarily focused on iron ore, aluminum, copper, and diamonds. Known for its large-scale operations and focus on technological advancements in mining, Rio Tinto plays a crucial role in supplying materials vital for infrastructure and manufacturing worldwide.

Market Dynamics and Investment Considerations
Investing in the metals and mining sector involves understanding commodity price volatility, geopolitical risks, environmental regulations, and the long-term demand trends driven by global development and technological shifts, such as the transition to renewable energy which requires specific metals like copper and lithium.

Related Sectors: Industrial Materials
Closely related to metals and mining is the broader industrial materials sector, which includes companies involved in processing raw materials into usable forms, manufacturing construction materials, chemicals, and other essential components for industry and consumer goods production.

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